Thermal chemistry of chlorine on Si/Cu(100)

Citation
J. Han et al., Thermal chemistry of chlorine on Si/Cu(100), LANGMUIR, 16(16), 2000, pp. 6541-6545
Citations number
14
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
LANGMUIR
ISSN journal
07437463 → ACNP
Volume
16
Issue
16
Year of publication
2000
Pages
6541 - 6545
Database
ISI
SICI code
0743-7463(20000808)16:16<6541:TCOCOS>2.0.ZU;2-6
Abstract
Photoelectron spectroscopy (PES) and temperature-programmed desorption (TPD ) studies investigated the chemistry of Cia on Si/Cu(100). Si deposition wa s carried out by exposing Cu(100) to SiH4 at 420 K. PES showed that the exp osure of this Si-saturated surface to Cia resulted in the formation of SiCl , SiCl2, and SiCl3 species at 120 K, with the latter species becoming more prevalent at higher Cl coverages. Heating of the chlorinated surface betwee n 120 and 500 K increased the concentration of SiCl3 species. TPD studies o f Cl-2/Si/Cu(100) as a function of Si coverage showed primarily SiCl3 (and probably SiCl2) desorption at the lower Si coverages and SiCl4 at the highe st Si coverage. The majority of the Si was not removed from the surface as chlorosilane product, but instead diffused into the Cu bulk at temperatures above 500 K