Electrical properties and annealing effects on the stress of RF-sputtered c-BN films

Citation
Xw. Zhang et al., Electrical properties and annealing effects on the stress of RF-sputtered c-BN films, MATER LETT, 45(2), 2000, pp. 111-115
Citations number
20
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS LETTERS
ISSN journal
0167577X → ACNP
Volume
45
Issue
2
Year of publication
2000
Pages
111 - 115
Database
ISI
SICI code
0167-577X(200008)45:2<111:EPAAEO>2.0.ZU;2-R
Abstract
The c-BN films prepared by RF sputtering were annealed immediately at tempe rature ranging from 773 to 1373 K in air and vacuum respectively. The therm al stability and the compressive film stress calculated from the frequency shift of cubic boron nitride (c-BN) infrared absorption peak were investiga ted. The results show that with increasing annealing temperatures the compr essive film stress decreases significantly, and the adhesion of c-BN film i s improved. The electrical measurements were performed for the annealed sam ples. The results show that the unintentionally doped c-BN films have n-typ e conductivity and the room temperature resistivity is in the range of 10(5 )-10(7) Omega cm, which is lower significantly than that of intrinsic bulk c-BN. The c-BN/p-Si heterojunction was fabricated and the I-V curve of this structure indicates typical semiconductor diode characteristics. (C) 2000 Elsevier Science B.V. All rights reserved.