The c-BN films prepared by RF sputtering were annealed immediately at tempe
rature ranging from 773 to 1373 K in air and vacuum respectively. The therm
al stability and the compressive film stress calculated from the frequency
shift of cubic boron nitride (c-BN) infrared absorption peak were investiga
ted. The results show that with increasing annealing temperatures the compr
essive film stress decreases significantly, and the adhesion of c-BN film i
s improved. The electrical measurements were performed for the annealed sam
ples. The results show that the unintentionally doped c-BN films have n-typ
e conductivity and the room temperature resistivity is in the range of 10(5
)-10(7) Omega cm, which is lower significantly than that of intrinsic bulk
c-BN. The c-BN/p-Si heterojunction was fabricated and the I-V curve of this
structure indicates typical semiconductor diode characteristics. (C) 2000
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