Structure and properties of hard and superhard Zr-Cu-N nanocomposite coatings

Citation
P. Zeman et al., Structure and properties of hard and superhard Zr-Cu-N nanocomposite coatings, MAT SCI E A, 289(1-2), 2000, pp. 189-197
Citations number
33
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN journal
09215093 → ACNP
Volume
289
Issue
1-2
Year of publication
2000
Pages
189 - 197
Database
ISI
SICI code
0921-5093(20000930)289:1-2<189:SAPOHA>2.0.ZU;2-T
Abstract
Zr-Cu-N nanocomposite films represent a new material of the type-nanocrysta lline transition metal nitride (nc-MeN)/metal. In the present work, films w ere deposited onto steel substrates using unbalanced de reactive magnetron sputtering of a Zr-Cu (62/38 at.%) target. Film structure, chemical composi tion, mechanical and optical properties were investigated by means of X-ray diffraction (XRD), scanning electron microscopy, transmission electron mic roscopy, energy dispersive X-ray spectroscopy, wavelength dispersive electr on probe microanalysis, depth-sensing microindentation and spectroscopic el lipsometry. It was found that (i) there is a strong correlation between the film structure, Cu content and film properties and (ii) either hard or sup erhard Zr-Cu-N films can be formed. The superhard coatings with hardness H > 40 GPa are characterized by a columnar structure, a strong 111 XRD peak f rom ZrN grains and no diffraction peaks from Cu. These films exhibit a high elastic recovery of about 80% and contain a very low amount of Cu, approxi mately 1-2 at.%. In contrast, the hard (< 40 GPa) Zr-Cu-N films are charact erized by many diffraction peaks from polyoriented ZrN and Cu grains, a mor e random microstructure and a Cu content higher than 2 at.%. The optical pr operties of nanocomposite Zr-Cu-N films depend on the stoichiometry of the hard ZrN, compound and the content of Cu in the film. (C) 2000 Elsevier Sci ence S.A. All rights reserved.