Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

Authors
Martins, R Ferreira, J Goncalves, C Nunes, P Fortunato, E Marvao, AP Martins, JI
Citation
R. Martins et al., Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes, MAT SCI E A, 288(2), 2000, pp. 275-279
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN journal
09215093 → ACNP
Volume
288
Issue
2
Year of publication
2000
Pages
275 - 279
Database
ISI
SICI code
0921-5093(20000915)288:2<275:ROSPOT>2.0.ZU;2-Z
Abstract
Results are presented on the electrical characteristics of power diodes sol dered using new lead-free techniques based on Cu-Sn-Cu joints. Special emph asis is put on the role of the thickness of the Cu films electrodeposited o n the electrical performances of the power diodes joined and to study the e lectrical stability of the joints formed, under extreme aggressive conditio ns. (C) 2000 Elsevier Science S.A. All rights reserved.