Absorbance and outgasing of photoresist polymeric materials for UV lithography below 193 nm including 157 nm lithography

Citation
Ac. Cefalas et al., Absorbance and outgasing of photoresist polymeric materials for UV lithography below 193 nm including 157 nm lithography, MICROEL ENG, 53(1-4), 2000, pp. 123-126
Citations number
9
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
53
Issue
1-4
Year of publication
2000
Pages
123 - 126
Database
ISI
SICI code
0167-9317(200006)53:1-4<123:AAOOPP>2.0.ZU;2-5
Abstract
The absorption spectra in the vacuum ultraviolet region of the spectrum fro m 140 to 200 nm, of various Si-based polymers and polymeric materials with aliphatic and aromatic structure for 157nm lithographic applications are di scussed in this paper. Si- based polymers seem to have the right value of a bsorbance at 157nm. Therefore they can be imaged at the usual bilayer thick ness of 0.1 mu m. Mass spectroscopic and outgasing studies at 157nm suggest that a complete bond breaking of the aromatic and linear carbon chains is taking place even at low values of the laser energy.