We present two tri-layer systems which can be used to improve the process l
atitude of nanoimprint lithography. By hot empossing, the top layer polymer
can easily deformed while the bottom layer, separated by a 10 nm thick ger
manium from the top layer, remains to be thermally stable. With a sequentia
l reactive ion etching, the top layer image can be transferred into the bot
tom layer with a large thickness contrast, thereby providing a way to gener
ate dense features with high aspect ratio. Consequently, commonly used patt
ern-transfer techniques such as lift-off, reactive ion etching and electrod
eposition can be employed.