Novel linear and crosslinking polymers for nanoimprinting with high etch resistance

Citation
K. Pfeiffer et al., Novel linear and crosslinking polymers for nanoimprinting with high etch resistance, MICROEL ENG, 53(1-4), 2000, pp. 411-414
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
53
Issue
1-4
Year of publication
2000
Pages
411 - 414
Database
ISI
SICI code
0167-9317(200006)53:1-4<411:NLACPF>2.0.ZU;2-4
Abstract
Aromatic polymers based on methacrylates (linear polymers) and multifunctio nal allylesters (crosslinked polymers) have been prepared. They feature hig h dry etch resistance and good imprintability in a hot embossing process. T he crosslinked polymers and their prepolymers were investigated in detail. Their characteristic molecular weight distribution and thermo-mechanical be haviour were studied with respect to the crosslinking process and compared with those of linear polymers. The thermal stability of imprinted patterns has been investigated for both, linear and crosslinked aromatic polymers. T he latter ones show excellent stability up to test temperatures of 200 degr ees C directly after the imprint process.