Device dependent control of chemical-mechanical polishing of dielectric films

Authors
Patel, NS Miller, GA Guinn, C Sanchez, AC Jenkins, ST
Citation
Ns. Patel et al., Device dependent control of chemical-mechanical polishing of dielectric films, IEEE SEMIC, 13(3), 2000, pp. 331-343
Citations number
15
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
ISSN journal
08946507 → ACNP
Volume
13
Issue
3
Year of publication
2000
Pages
331 - 343
Database
ISI
SICI code
0894-6507(200008)13:3<331:DDCOCP>2.0.ZU;2-F
Abstract
This paper presents a control scheme for run-to-run control of chemical-mec hanical polishing (CMP). The control scheme tracks both device pattern depe ndent and equipment induced disturbances. The structure of the controller i s such that sensitivity to qual (unpatterned blanket oxide) wafer frequency is minimized. Additionally, prethickness variation and metrology delay are accounted for in the design. Results from applying this scheme in volume p roduction are presented.