A one-dimensional assembly of copper(II) polyhedra via dual use of hydrogen-bonding and pi-pi interaction

Authors
Sangeetha, NR Pal, S Anson, CE Powell, AK Pal, S
Citation
Nr. Sangeetha et al., A one-dimensional assembly of copper(II) polyhedra via dual use of hydrogen-bonding and pi-pi interaction, INORG CH C, 3(8), 2000, pp. 415-419
Citations number
26
Categorie Soggetti
Inorganic & Nuclear Chemistry
Journal title
INORGANIC CHEMISTRY COMMUNICATIONS
ISSN journal
13877003 → ACNP
Volume
3
Issue
8
Year of publication
2000
Pages
415 - 419
Database
ISI
SICI code
1387-7003(200008)3:8<415:AOAOCP>2.0.ZU;2-M
Abstract
A copper(IT) complex [Cu(Hpadh)Cl-2] with pyridine-N, imine-N and amide-O c oordinating 2-pyridine-carboxaldehyde 4-dimethyl-aminobenzoylhydrazone (Hpa dh) has been synthesized and structurally characterized. In the solid state , each square-pyramidal Cu(Hpadh)Cl-2 unit is connected to one neighbour by a pair of hydrogen bonds between the amide-H and the apical chloride and t o the other by a couple of pi-pi interactions between the aromatic rings of the coordinated ligands forming a novel chain-like arrangement of copper(I I) centres with successive long and short Cu ... Cu distances. Variable tem perature (300-18 K) magnetic susceptibility measurements showed that the co mplex is essentially Curie paramagnetic. (C) 2000 Elsevier Science S.A. All rights reserved.