Atomistic simulation of microcrack healing in aluminium

A molecular dynamics method is used to simulate microcrack healing during h eating or under compressive stress. A centre microcrack in Al crystal could be sealed by a critical compressive stress or by heating over a critical t emperature. During microcrack healing, dislocation generation and motion oc curred. When there were pre-existing dislocations around the microcrack, th e critical temperature necessary for microcrack healing would decrease from 850 to 650 K. The critical temperature necessary for microcrack healing de pended upon the orientation of the crack plane. For example, the critical t emperature of the crack along the (111) plane was the lowest.