Characterization of the plasma during the growth of CNx films by RF magnetron sputtering

Citation
Na. De Sanchez et al., Characterization of the plasma during the growth of CNx films by RF magnetron sputtering, PHYS ST S-B, 220(1), 2000, pp. 697-701
Citations number
15
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICA STATUS SOLIDI B-BASIC RESEARCH
ISSN journal
03701972 → ACNP
Volume
220
Issue
1
Year of publication
2000
Pages
697 - 701
Database
ISI
SICI code
0370-1972(200007)220:1<697:COTPDT>2.0.ZU;2-M
Abstract
In this work a single Langmuir probe has been used to determine in-situ the plasma electronic temperature (T-e) and the electronic density (eta(e)) of an rf magnetron sputtering system used to grow CNx films. Sodium chloride substrates and a carbon target (99.999%) in a mixture of Ar/N-2 were used. From the voltage-current characteristics, the electronic temperature in the range of 3 to 11 eV and an electronic density in the range of 10(9) cm(-3) , depending on the pressure and the relationship Ar/N-2 in the gas mixture, were determined. These results were correlated with Fourier Transformed In frared Transmission Spectroscopy (FTIR) of the films. The stress bands in t he infrared spectra were found located at 1357, 1589 and 2247 cm(-1); these bands are related to the primary (C-N), double (C=N) and triple (C equival ent to N) bonds, respectively. On the other hand, the chemical reactions in a discharge are generated basically by electronic impacts; so, knowing the temperature and electronic density, the plasma processes can be controlled during the dim preparation to favor CNx deposition.