Microvias and RF - ready for 10GHz?

As rise times reduce and the frequencies of the signals travelling across m odern multilayer pcbs and substrates increase, there is much emphasis on si gnal integity and keeping the signals on the boards (EMC obligations). As t he physical dimensions continue to shrink and the multi-layer assisted pack ing densities increase, what will happen to RF performance? This review of microvia and microstructure test results attempts to find an answer to the question - ready for 10GHz?