This paper presents a modeling and simulation approach for ground/power pla
nes in high speed packages. A plane pair structure is first characterized i
n terms of its impedance (Z) matrix at arbitrary port locations in the freq
uency domain. This solution is then extended for multiple plane pairs under
the assumption that skin effect is prominent at higher frequencies causing
isolation between the layers, Since the solutions are in analytical form,
the frequency and transient response can be computed efficiently requiring
small computational time. To develop spice models, equivalent circuits are
constructed using resonator models with passive elements using model order
reduction methods. This paper also discusses a method for incorporating dec
oupling capacitors into the plane models. The simulation results show good
correlation with measured data.