Broadband modeling and measurement of the signal behavior in S/390 MCM packages

Citation
Fm. Ktata et al., Broadband modeling and measurement of the signal behavior in S/390 MCM packages, IEEE T AD P, 23(3), 2000, pp. 375-381
Citations number
5
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON ADVANCED PACKAGING
ISSN journal
15213323 → ACNP
Volume
23
Issue
3
Year of publication
2000
Pages
375 - 381
Database
ISI
SICI code
1521-3323(200008)23:3<375:BMAMOT>2.0.ZU;2-P
Abstract
In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages, We present lumped RLC-models suitable fo r standard circuit simulators like e.g. SPICE. The models are developed fro m finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer me asurements we validate the models in a frequency range up to 3 GHz.