A fast 3-D modeling approach to electrical parameters extraction of bonding wires for RF circuits

Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF applications. An approach to fast three-dimensional ( 3-D) modeling of the geometry for bonding wires in RF circuits and packages is demonstrated. The geometry can readily be used to extract electrical pa rameters such as inductance and capacitance. An equivalent circuit is prese nted to model the frequency response of bonding wires. To verify simulation accuracy, test structures have been made and measured. Excellent agreement between simulated and measured data is achieved for frequencies up to 10 G Hz. The model is well suited for the design and analysis of circuits for ce llular phone communication (i.e., order 2 GHz) and future wireless communic ation (i.e., order 5 GHz).