A compact three-dimensional packaging technique using super-fine-pitch coaxial connector arrays for on-board satellite equipment

A compact three-dimensional (3-D) inter-module microwave packaging techniqu e has been developed that drastically reduces the volume of on-board satell ite equipment of phased-array beam control (PBC), A super-fine-pitch coaxia l connector (SCC) array has been successfully implemented with this 3-D str ucture along with very flat, superior-performance ceramic MMIC packages and combiner packages. Two types of SCC have been developed-a lead-to-jack arr ay and a plug-to-plug array-both of which have a 2-mm pin pitch. Through ap plication of this 3-D packaging technique to S-band 64-beam 32-radiator PBC equipment, an ultra-small packaging unit was developed that houses a 32 x 64 interconnection in a 2600-cc chassis. This technique promises to make po ssible compact, light-weight on-board PBC equipment that is especially suit able for use in satellite transponders.