A simple nondestructive evaluation of an adhesive layer using elastic wavevelocities

Citation
M. Matsukawa et al., A simple nondestructive evaluation of an adhesive layer using elastic wavevelocities, JPN J A P 1, 39(5B), 2000, pp. 2950-2951
Citations number
5
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Volume
39
Issue
5B
Year of publication
2000
Pages
2950 - 2951
Database
ISI
SICI code
Abstract
A curing process of epoxy adhesive layers has been investigated by an ultra sonic pulse spectroscopy and a Brillouin scattering technique. Observed lon gitudinal elastic wave velocities in the curing layer depended on the veloc ity in the prepolymer used. From this result, we suggest a simple nondestru ctive method for the estimation of sample T-g (glass transition temperature ) during cure. The estimated T-g values were in good accordance with the T- g values easured by differential scanning calorimetry.