We report the ohmic contact formation mechanism for a low contact resistanc
e PdGe-based system on a GaAs sample containing highly and poorly doped lay
ers annealed in the temperature range of 380-450 degrees C. The lowest aver
age specific contact resistance of the Pd/Ge/Ti/Pt ohmic contact was 2.4 x
10(-6) Omega.cm(2) after annealing at 400 degrees C. This was believed to b
e due to the formation of a Ga5Pd compound. Cross-sectional scanning electr
on microscopy and Auger electron spectroscopy were utilized in this study.
The contact was thermally stable after isothermal annealing at 400 degrees
C for 6 h.