Defect generation phenomena in Si wafers during atmospheric pressure rapid
thermal processing (RTP) in a single wafer furnace (SWF) are investigated a
s a function of temperature, process time, wafer handling method and speed.
The size, shape and spatial distribution of crystal defects generated duri
ng RTP were characterized using an optical microscope and X-ray topography.
The wafer handling method and speed are found to be very important in cont
rolling defect generation during RTP under given process conditions. Highly
reproducible slip-free RTP results were achieved in 200-mm-diameter Si waf
ers processed at 1100 degrees C for 60 s (up to 5 times) by optimizing the
wafer handling method and speed.