Predicted thermally induced stresses in, and the bow of, a circular substrate/thin-film structure

An easy-to-apply analytical ("mathematical") stress model is developed for the prediction of the stresses in, and the bow of, a circular substrate/thi n-film structure subjected to a change in temperature. The model can be hel pful for stress-strain analyses and physical design of thin film systems fa bricated on circular substrates, experiencing thermally induced bending def ormations. Structures of this type are widely used in microelectronics and photonics packaging engineering. (C) 2000 American Institute of Physics. [S 0021-8979(00)08613-8].