D. Barreca et al., Al2O3 thin films from aluminium dimethylisopropoxide by metal-organic chemical vapour deposition, J MAT CHEM, 10(9), 2000, pp. 2127-2130
This paper focuses on the use of aluminium dimethylisopropoxide as a novel
precursor for the chemical vapour deposition of alumina thin films. The fra
gmentation pattern of this compound was studied by mass spectrometry, while
its volatility and decomposition route were analysed by in-line FT-IR spec
troscopy. Aluminium oxide films were grown in the temperature range 540-600
degrees C at a total pressure of 100 Pa in a nitrogen-oxygen atmosphere. A
kinetic model was developed which includes an overall heterogeneous reacti
on and a parasitic one in the gas phase with apparent activation energies o
f 130 kJ mol(-1) and 209 kJ mol(-1) respectively. The microstructure, compo
sition and morphology of the obtained layers were analysed respectively by
X-ray diffraction, X-ray photoelectron spectroscopy and atomic force micros
copy. The aluminium oxide films obtained were transparent, amorphous, stoic
hiometric, carbon-free and smooth. An island growth was proposed. Uniform g
rowth rates along the reactor of 16, 32 and 57 nm min(-1) are found at depo
sition temperatures in the range of 560-570 degrees C, at precursor evapora
tion temperatures of 15, 25 and 35 degrees C respectively.