Evolution of the mechanical stress on PECVD silicon oxide films under thermal processing

Authors
Rodriguez, JA Llobera, A Dominguez, C
Citation
Ja. Rodriguez et al., Evolution of the mechanical stress on PECVD silicon oxide films under thermal processing, J MAT SCI L, 19(16), 2000, pp. 1399-1401
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028 → ACNP
Volume
19
Issue
16
Year of publication
2000
Pages
1399 - 1401
Database
ISI
SICI code
0261-8028(200008)19:16<1399:EOTMSO>2.0.ZU;2-0