F. Cristiano et al., INTERSTITIAL TRAPPING EFFICIENCY OF C- CONTROL OF EOR DEFECTS( IMPLANTED INTO PREAMORPHISED SILICON ), Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 127, 1997, pp. 22-26
The trapping of Si interstitials by C+ implantation has been quantifie
d by following the evolution of EOR defects during thermal annealing.
Si (100) n-type wafers have been preamorphised by the implantation of
150 keV Ge+ ions to a dose of 2 x 10(15) ions/cm(2) to form a 175 nm t
hick amorphous layer, followed by C+ implantation at 65 keV (R-p = 175
nm) to doses ranging from 3 x 10(13) ions/cm(2) to 3 x 10(15) ions/cm
(2). All samples were then annealed at 1000 degrees C for 15 s. These
structures have been investigated by RES, TEM and SIMS. The mean radiu
s of the EOR loops monotonically decreases with increasing dose of Cinns while their density increases, The number of Si self-interstitial
s stored in the loops also decreases with increasing carbon dose. This
effect is associated with the capture of Si self-interstitials by Si-
C complexes. The effective trapping efficiency of carbon is about 1.18
interstitials per carbon atom, which is consistent with values obtain
ed from studies of B transient enhanced diffusion.