CLEANING OF METAL-SURFACES BY A BROAD-BEAM ION-SOURCE

To describe and analyse a process of the surface cleaning by ion beams , a simple model based on the static TRIM92 code is presented and comp ared with the dynamic T-Dyn code. Although we have found a systematic shift between values based on TRIM92 and T-Dyn calculations, a combina tion of both methods made possible to analyse a process of removing ul tra-thin carbon films from a copper surface, The simulation confirmed that to increase the efficiency of the cleaning process, the sputterin g should be carried out at higher angles of incidence (60 degrees-70 d egrees). The energy of the ion beam should be kept as low as possible to reduce a penetration of recoil carbon atoms into copper (at least d uring the final phase of the sputtering process), On the other hand, t he sputtering yield corresponding to low ion energies may not be high enough to keep the etching process going on, Thus, the energy of 500-2 000 eV seems to be a reasonable compromise between these two opposite requirements.