The effect of corrosion on the performance of high speed multi-chip moduleinterconnects

Authors
Guan, L Christou, A Barbe, DF
Citation
L. Guan et al., The effect of corrosion on the performance of high speed multi-chip moduleinterconnects, QUAL REL EN, 16(4), 2000, pp. 255-260
Citations number
6
Categorie Soggetti
Engineering Management /General
Journal title
QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL
ISSN journal
07488017 → ACNP
Volume
16
Issue
4
Year of publication
2000
Pages
255 - 260
Database
ISI
SICI code
0748-8017(200007/08)16:4<255:TEOCOT>2.0.ZU;2-U
Abstract
A new methodology to incorporate the effect of failure mechanisms into inte rconnection circuit performance simulation is developed. The effect of corr osion on the performance of high speed multi-chip module interconnects has been investigated. The method presented in this paper may be applied to the study of other failure mechanisms through the simulation of the gradual de gradation of signal integrity. Copyright (C) 2000 John Wiley & Sons, Ltd.