Adhesion between rubber compounds and copper-film-coated steel plates

Citation
Pl. Cho et al., Adhesion between rubber compounds and copper-film-coated steel plates, J ADHESION, 73(1), 2000, pp. 43-63
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF ADHESION
ISSN journal
00218464 → ACNP
Volume
73
Issue
1
Year of publication
2000
Pages
43 - 63
Database
ISI
SICI code
0021-8464(2000)73:1<43:ABRCAC>2.0.ZU;2-B
Abstract
Three copper-film-coated steel plates (abbreviated hereafter as copper-coat ed plate) with different thicknesses of copper film 30 to 90 nm were prepar ed and their adhesion properties to rubber compounds were examined. The hig h adhesion of copper-coated plates to the rubber compound containing resino us bonding additives was obtained at normal and over-cure conditions The co pper-coated plate containing an amount of copper coating sufficient to plat e the surface with a uniform copper layer showed better adhesion than that having a small amount of copper coating on its surface. The stability again st green humidity aging and the cause for the high adhesion of the copper-c oated plate were discussed compared with those of the brass plate.