Eag. Hamers et al., Contribution of ions to the growth of amorphous, polymorphous, and microcrystalline silicon thin films, J APPL PHYS, 88(6), 2000, pp. 3674-3688
The growth of amorphous, microcrystalline, and polymorphous silicon has bee
n investigated by studying the species contributing to the growth and resul
ting film structure. The surface reaction probability of the radicals and t
he contribution of ions to the growth have been determined. In a-Si:H depos
ition by hot wire chemical vapor deposition, the surface reaction probabili
ty (beta=0.29) of the depositing radical is compatible with SiH3, whereas t
he surface reaction probability in microcrystalline silicon growth is highe
r (0.36 less than or equal to beta less than or equal to 0.54). On the cont
rary, the deposition of amorphous silicon by plasma enhanced chemical vapor
deposition indicates the contribution of more reactive radicals than SiH3.
The deposition of polymorphous and microcrystalline silicon by plasma is d
ominated by ions, which can contribute up to 70% of the deposited film. Thi
s is attributed to efficient ionization of silane in charge exchange reacti
ons with hydrogen ions. The surface reaction probability in the case of pol
ymorphous silicon deposition (beta approximate to 0.30) is intermediate bet
ween that of a-Si:H deposition (beta approximate to 0.40) and that of micro
crystalline silicon deposition (beta approximate to 0.20). Etching of amorp
hous silicon by means of a hydrogen plasma shows that ions may hinder the p
rocess. (C) 2000 American Institute of Physics. [S0021-8979(00)05619-X].