Comparison of GaAs grown on standard Si (511) and compliant SOI (511)

Citation
Ml. Seaford et al., Comparison of GaAs grown on standard Si (511) and compliant SOI (511), J ELEC MAT, 29(7), 2000, pp. 906-908
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
29
Issue
7
Year of publication
2000
Pages
906 - 908
Database
ISI
SICI code
0361-5235(200007)29:7<906:COGGOS>2.0.ZU;2-X
Abstract
Gallium arsenide (GaAs) films were grown by molecular beam epitaxy (MBE) on a (511) silicon substrate and a compliant (511) silicon-on-insulator (SOI) substrate. The top silicon layer of the compliant (511) SOI was thinned to similar to 1000 Angstrom. The five inch diameter SOI wafer was created by wafer bonding. The GaAs (004) x-ray diffraction (XRD) reflection showed a 2 5% reduction in the full width half maximum (FWHM) for GaAs on a compliant (511) SOI as compared to GaAs on a silicon substrate. Cross section transmi ssion electron microscopy (XTEM) clearly indicates a different dislocation structure for the two substrates. The threading dislocation density is redu ced by at least an order of magnitude in the compliant (511) SOI as compare d to the (511) silicon. XTEM found dislocations and damage was generated in the top silicon layer of the compliant SOI substrate after GaAs growth.