We used high-resolution x-ray diffraction to measure precisely structural m
odifications in variously composed Hg1-xCdxTe layers which were fabricated
by different growth techniques and subjected to boron implantation to form
p-n junctions. Analysis of implantation-induced features in the diffraction
profiles allowed us to deduce the interstitials concentration remaining in
the sample interior and, thus, to obtain important information on post-imp
lantation defect migration. As a result, a percolation problem in the migra
tion of Cd interstitials was discovered in samples with x < x(c) (x(c) = 0.
265 is the percolation threshold). Due to the percolation problem, the impl
anted samples having Cd content below and above x(c) exhibited very differe
nt surface recovery, which was visualized by high resolution scanning elect
ron microscopy. It was found that additional annealing at 250-300 degrees C
stimulates diffusion of formerly locked Cd interstitials and leads to the
change in the conductivity type (n-p) at the expense of remaining non-compe
nsated vacancies. The percolation problem in samples with x < x(c) seems to
be responsible for limited mobility of implanted boron and difficulties in
boron activation in Hg1-xCdxTe-based devices for 8-12 mu m atmospheric tra
nsparency window.