Microelectronic packaging and assembling

Authors
Danto, Y Lall, P Tay, AAO
Citation
Y. Danto et al., Microelectronic packaging and assembling, MICROEL REL, 40(7), 2000, pp. 1069-1071
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
40
Issue
7
Year of publication
2000
Pages
1069 - 1071
Database
ISI
SICI code
0026-2714(200007)40:7<1069:MPAA>2.0.ZU;2-W