Near-CSP plastic ball grid array

The mold array process plastic ball grid array continues to demonstrate pro gress as a cost-effective, medium to high performance electronics package. Highly manufacturable and reliable solutions to the challenges of molding u p to several hundred packages at one time as well as subsequent singulation of the packages have been found. JEDEC moisture performance at up to Level 1 with 220 degrees C reflow temperatures has been qualified for production . Thermal performance remains critically dependent on die size, package siz e, and motherboard construction. (C) 2000 Elsevier Science Ltd. All rights reserved.