Method for rapid testing of thermo-mechanical characteristics of solder joints

Citation
M. Nowottnick et al., Method for rapid testing of thermo-mechanical characteristics of solder joints, MICROEL REL, 40(7), 2000, pp. 1135-1146
Citations number
6
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
40
Issue
7
Year of publication
2000
Pages
1135 - 1146
Database
ISI
SICI code
0026-2714(200007)40:7<1135:MFRTOT>2.0.ZU;2-0
Abstract
The creep behavior of alternative soft solder alloys is not, as a rule, wel l known. This characteristic is however very important for the prediction o f a joint's long-term reliability. Conventional test methods are often impr actical, slow and deliver only qualitative results. The new testing method presented is able to provide very fast quantitative Values of thermo-mechan ical characteristics. This paper shows latest results, comparison with stan dard testing, investigation of high temperature applications and new fields of use. (C) 2000 Published by Elsevier Science Ltd.