The creep behavior of alternative soft solder alloys is not, as a rule, wel
l known. This characteristic is however very important for the prediction o
f a joint's long-term reliability. Conventional test methods are often impr
actical, slow and deliver only qualitative results. The new testing method
presented is able to provide very fast quantitative Values of thermo-mechan
ical characteristics. This paper shows latest results, comparison with stan
dard testing, investigation of high temperature applications and new fields
of use. (C) 2000 Published by Elsevier Science Ltd.