Citation
Mg. Perichaud et al., Reliability evaluation of adhesive bonded SMT components in industrial applications, MICROEL REL, 40(7), 2000, pp. 1227-1234
Citations number
14
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714
→ ACNP
Volume
40
Issue
7
Year of publication
2000
Pages
1227 - 1234
Database
ISI
SICI code
0026-2714(200007)40:7<1227:REOABS>2.0.ZU;2-0
Abstract
This paper compares the efficiency of two thermosetting and one thermoplast
ic conductive adhesives for surface mount technology (SMT) assemblies. Thei
r reliability is evaluated during accelerated life tests through electrical
and mechanical measurements. Contact metallizations are taken into account
. Finite element simulations confirm the experimental results, and a parame
tric study permits us to define some choice criteria for the physical prope
rties of adhesives. (C) 2000 Elsevier Science Ltd. All rights reserved.