Wear mechanisms of diamond abrasives during transition and steady stages in creep-feed grinding of structural ceramics

Citation
Tw. Liao et al., Wear mechanisms of diamond abrasives during transition and steady stages in creep-feed grinding of structural ceramics, WEAR, 242(1-2), 2000, pp. 28-37
Citations number
18
Categorie Soggetti
Material Science & Engineering
Journal title
WEAR
ISSN journal
00431648 → ACNP
Volume
242
Issue
1-2
Year of publication
2000
Pages
28 - 37
Database
ISI
SICI code
0043-1648(200007)242:1-2<28:WMODAD>2.0.ZU;2-7
Abstract
A study was performed to quantify the wear mechanisms of diamond abrasives of a resin bonded diamond wheel (320 US mesh and 100 concentration) in cree p-feed grinding of a silicon nitride material. This was achieved with a com bined use of a lead-tape imprint technique and SEM. The wear mechanisms obs erved include attritious wear, fracture (or chipping), mixed mode of wear a nd fracture, and dislodgment (or pullout). The percentage of each wear mech anism was quantified for different points of the grinding process: five dur ing the transition stage and six during the steady stage. The results indic ate that: (1) the percentage of grits not involved in removing the first 10 cm(3)/cm volume of material per unit width was high (similar to 70%) and d ecreased as more material was removed (from - 50% to 20% during the steady stage). (2) Attritious wear dominated the wear mechanism and the percentage increased as more material was removed (from similar to 15% to 30% during the transition stage and from similar to 50% to 75% during the steady stage ). Correspondingly, the percentage of wear-flat area also increased. (3) Th e percentages of grit dislodgment and grit fracture were relatively higher during the transition stage than during the steady stage. (4) The number of active grits per unit area increased with cumulative volume of material re moved. (5) Specific forces increase nonlinearly with wear-nat percentage an d the percentage of worn grits. (C) 2000 Published by Elsevier Science S.A.