A novel isolation technique which consists of a modified local oxidati
on of silicon (LOCOS) process with a nitrogen-doped amorphous-Si space
r has been developed, Nitrogen doping of amorphous-Si reduces its oxid
e growth rate, This isolation process shows the least encroachment, sm
allest maximum stress, and a deeper field oxide recess as compared to
standard LOCOS or poly spacer LOCOS, The oxidation of nitrogen-doped a
morphous-Si also has been simulated by an equivalent stacked layer.