Experiments were performed to assess the Feasibility of single-phase and tw
o-phase micro heat sinks applied to the cooling of power components. After
a brief recall of the principal characteristics of a power component (IGBT,
Insulated Gate Bipolar Transistor), experimental measurements are describe
d for multichip modules cooled by single-phase or two-phase hear sinks mach
ined in a piece of copper. The former is composed of rectangular microchann
els, the second is composed of circular minichannels. Both offer very high
cooling capabilities. Then, a comparison of performance is presented. (C) 2
000 Editions scientifiques et medicales Elsevier SAS.