Direct writing of electronic and sensor materials using a laser transfer technique

We present a laser-based direct write technique termed matrix-assisted puls ed-laser evaporation direct write (MAPLE DW). This technique utilizes a las er transparent fused silica disc coated on one side with a composite matrix consisting of the material to be deposited mixed with a laser absorbing po lymer. Absorption of laser radiation results in the decomposition of the po lymer, which aids in transferring the solute to an acceptor substrate place d parallel to the matrix surface. Using MAPLE DW, complex patterns consisti ng of metal powders, ceramic powders, and polymer composites were transferr ed onto the surfaces of various types of substrates with <10 micron resolut ion at room temperature and at atmospheric pressure without the use of mask s.