Intermolecular energy transfer at a solid-liquid interface

It is known that a temperature jump appears at a solid-liquid interface whe re high heat pur is applied. The molecular mechanism of this thermal resist ance at the interface was analyzed in the present study based on the concep t of the intermolecular energy transfer (IET) proposed by the present autho r. A molecular dynamics simulation has been performed for a system of a liq uid layer between two parallel solid walls at different temperatures and th e IET characteristics at the interface were examined. It was found that at the interface, intermolecular energy transfer reverse to the macroscopic he at flux occurs in a wide range of the intermolecular distance, which reduce s the macroscopic heat flux.