Excimer laser-induced damage in bilayer carbide/polyimide systems

Citation
G. Danev et al., Excimer laser-induced damage in bilayer carbide/polyimide systems, ADV MAT OPT, 9(6), 1999, pp. 227-234
Citations number
15
Categorie Soggetti
Material Science & Engineering
Journal title
ADVANCED MATERIALS FOR OPTICS AND ELECTRONICS
ISSN journal
10579257 → ACNP
Volume
9
Issue
6
Year of publication
1999
Pages
227 - 234
Database
ISI
SICI code
1057-9257(199911/12)9:6<227:ELDIBC>2.0.ZU;2-T
Abstract
The effect of XeCl (308 nm, 20 and 75 ns) excimer laser ablation of 30-40 n m thick carbide layers (TiC, Cr3C2, B4C) deposited on 2000 nm polyimide in the laser fluence range 10-1300 mJ cm(-2) has been investigated. The surfac e modification in the ablated spot areas has been observed. At fluences of 100-250 mJ cm(-2), complete removal of the carbide layers was achieved with out damage to the bottom polyimide layer. Ablation at fluences above 250 mJ cm(-2) caused interface damage and a different polyimide behaviour under R IE in oxygen, Copyright (C) 2000 John Wiley & Sons, Ltd.