The increasingly rapid transition of the electronics industry to high-densi
ty, high-performance multifunctional microprocessor Si technology has preci
pitated migration to new materials alternatives that can satisfy stringent
requirements. One of the recent innovations has been the substitution of co
pper for the standard aluminum-copper metal wiring in order to decrease res
istance and tailor RC delay losses in the various hierarchies of the wiring
network. This has been accomplished and the product shipped only since the
fall of 1998, after more than a decade of intensive development. Critical
fabrication innovations include the development of an electroplating proces
s for the copper network, dual-damascence chem-mech polishing (CMP), and ef
fective liner material for copper diffusion barrier and adhesion promotion.
The present copper technology provides improved current-carrying capabilit
y by higher resistance to electromigration, no device contamination by copp
er migration, and the performance enhancement analytically predicted. This
success of the shift to copper will accelerate the industry movement to fin
er features and more complex interconnect structures with sufficient device
density and connectivity to integrate full systems on chips. The next inno
vation will be the introduction of low-dielectric constant material that, i
n combination with copper, will create added excitement as the industry lea
rns how to utilize this new capability.