IC-compatible polysilicon surface micromachining

Polysilicon surface micromachining is advancing significantly and many new applications are moving beyond the prototyping phase. Recent technical succ esses are leading to excitement concerning various uses of devices in optic al, wireless, sensor, and many other areas. Incorporation of state-of-the-a rt integrated circuit (IC) fabrication methods, such as planarization by ch emical mechanical polishing (CMP), has enabled extension to a five-level te chnology. This has opened significant design space, especially for microact uator applications. Recent advancement of in situ microdiagnostics for mate rials and surface properties has enhanced our understanding of device relia bility and performance and will allow devices to operate near well-known ma terials limits. New IC-compatible materials will further enhance the capabi lities of microsystems in terms of performance, reliability, and operation in harsh environments.