16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit

We report the flip-chip bonding of a 16 x 16 array of 970-nm vertical-cavit y surface-emitting lasers (VCSELs) to an array of silicon CMOS driver circu its. The small-signal bandwidth of a flip-chip bonded VCSEL is in excess of 4 GHz, Individual VCSELs are capable of being modulated by the CMOS circui ts at 1 Gb/s, The thermal impedance of the flip-chip bonded VCSELs is 1 deg rees C/mW. The measured crosstalk suppression between channels is approxima tely 20 dB, Simultaneous parallel testing of up to 80 VCSELs at 1 Gb/s per VCSEL is demonstrated.