Examination of the thermophysical bond of insert-molded PC/C fiber composites

Citation
Cw. Extrand et S. Bhatt, Examination of the thermophysical bond of insert-molded PC/C fiber composites, J MATER SCI, 35(21), 2000, pp. 5427-5432
Citations number
32
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE
ISSN journal
00222461 → ACNP
Volume
35
Issue
21
Year of publication
2000
Pages
5427 - 5432
Database
ISI
SICI code
0022-2461(200011)35:21<5427:EOTTBO>2.0.ZU;2-H
Abstract
The adhesive strength of a thermophysical bond between two polymers has bee n examined using fracture mechanics. Bimaterial composite specimens were co nstructed by injecting C fiber polyetheretherketone (PEEK) into a mold cont aining one-half of a polycarbonate (PC) dogbone. The resulting series speci mens were notched at the interface and tested in tension. Adhesion of the t wo materials was reasonably good, as demonstrated by fracture surfaces that showed a mixture of PC and C fiber PEEK fragments. Interfacial fracture en ergy of the composite was approximately 1.5 kJ/m(2), which is comparable to the cohesive strength of amorphous commodity polymers. Variations in test speed (below the glass transition temperature of the two components, approx imately 140 degrees C) had no appreciable affect on stiffness or fracture e nergy. However, fracture energies decreased slightly as temperature increas ed. (C) 2000 Kluwer Academic Publishers.