The failure analysis of electronic devices and deduction of the emission or
igins of dust particles in clean processes or in urban air require a precis
e three-dimensional microanalysis method. In order to investigate the new t
hree-dimensional microanalysis for these samples with arbitrary shape and h
eterogeneity, we are developing a novel three-dimensional microanalyser con
sisting of a focused electron beam for Auger mapping and a gallium focused
ion beam for cross-sectioning and for time-of-flight SIMS mapping. Our mult
ibeam system is based on these three purposes. An ion and electron dual foc
used-beam apparatus was constructed to realize our concept, In this paper,
the concept and the application of our analysis to a wire-pad contact regio
n is described, The results of the elemental map in the contact interface s
how the superiority of our method. Copyright (C) 2000 John Wiley & Sons, Lt
d.