Surface dispersion hardening Cu matrix alloy

Authors
Citation
Zy. Shi et Dq. Wang, Surface dispersion hardening Cu matrix alloy, APPL SURF S, 167(1-2), 2000, pp. 107-112
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
APPLIED SURFACE SCIENCE
ISSN journal
01694332 → ACNP
Volume
167
Issue
1-2
Year of publication
2000
Pages
107 - 112
Database
ISI
SICI code
0169-4332(20001016)167:1-2<107:SDHCMA>2.0.ZU;2-F
Abstract
An aluminizing and internal oxidation technique had been used in hardening the surface of pure copper. The aluminum concentration distribution in alum inized layer, microstructure and some properties of surface hardening layer were studied. Results show that the aluminum concentration in surface of a luminized layer approaches aluminum content in the aluminized agent, the al uminized layer depth reached is 100 mu m It is possible to generate Al2O3 p articles dispersed hardening layer in the surface of pure copper with alumi nizing and oxidation technique, the amount of Al2O3 particles in surface ha rdening layer also effects the microhardness, the specific resistance, and wear resistance of the prepared copper matrix alloys. (C) 2000 Published by Elsevier Science B.V.