An aluminizing and internal oxidation technique had been used in hardening
the surface of pure copper. The aluminum concentration distribution in alum
inized layer, microstructure and some properties of surface hardening layer
were studied. Results show that the aluminum concentration in surface of a
luminized layer approaches aluminum content in the aluminized agent, the al
uminized layer depth reached is 100 mu m It is possible to generate Al2O3 p
articles dispersed hardening layer in the surface of pure copper with alumi
nizing and oxidation technique, the amount of Al2O3 particles in surface ha
rdening layer also effects the microhardness, the specific resistance, and
wear resistance of the prepared copper matrix alloys. (C) 2000 Published by
Elsevier Science B.V.