Several practical issues in the fabrication and high-temperature operation
of micro suspended hearing structures compatible with standard CMOS technol
ogy are reported. Suspended microstructures are fabricated in a standard CM
OS process and are released by post-process silicon etching. Addition of 15
vol% of isopropyl alcohol (TPA) to 25-wt% tetra-methyl ammonium hydroxide
(TMAH) is found to greatly increase yield of the post-process release etch.
Electrothermal properties of the polysilicon are investigated during high-
temperature operation. Significant thermally induced drift (reduction) in r
esistance at high temperatures is found, and the impact on temperature cont
rol is discussed Thermal isolation is found to be about 50 K/mW, and reliab
le operation is observed at a temperature estimated to be around 1000 degre
es C.