CMOS-compatible high-temperature microheater: Microstructure release and testing

Citation
O. Grudin et al., CMOS-compatible high-temperature microheater: Microstructure release and testing, CAN J EL C, 25(1), 2000, pp. 29-33
Citations number
9
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
CANADIAN JOURNAL OF ELECTRICAL AND COMPUTER ENGINEERING-REVUE CANADIENNE DE GENIE ELECTRIQUE ET INFORMATIQUE
ISSN journal
08408688 → ACNP
Volume
25
Issue
1
Year of publication
2000
Pages
29 - 33
Database
ISI
SICI code
0840-8688(200001)25:1<29:CHMMRA>2.0.ZU;2-V
Abstract
Several practical issues in the fabrication and high-temperature operation of micro suspended hearing structures compatible with standard CMOS technol ogy are reported. Suspended microstructures are fabricated in a standard CM OS process and are released by post-process silicon etching. Addition of 15 vol% of isopropyl alcohol (TPA) to 25-wt% tetra-methyl ammonium hydroxide (TMAH) is found to greatly increase yield of the post-process release etch. Electrothermal properties of the polysilicon are investigated during high- temperature operation. Significant thermally induced drift (reduction) in r esistance at high temperatures is found, and the impact on temperature cont rol is discussed Thermal isolation is found to be about 50 K/mW, and reliab le operation is observed at a temperature estimated to be around 1000 degre es C.