Osa. Tang et al., Design and fabrication of a wideband 56-to 63-GHz monolithic power amplifier with very high power-added efficiency, IEEE J SOLI, 35(9), 2000, pp. 1298-1306
This paper describes the design, fabrication, and measurement of a wideband
60 GHz monolithic microwave integrated circuit (MMIC) power amplifier that
has demonstrated via on-wafer continuous wave (CW) measurement a record 43
% power-added efficiency (PAE) at an associated output power of 224 mW and
7.5 dB of power gain. At a higher drain bias of 3.5 V, the CW output power
increased to 250 mW with 38.5% PAE. Additional performance improvement is e
xpected when the MMICs are tested on-carrier with proper heat sinking. Thes
e state-of-the-art first-pass design results can be attributed to: 1) the u
se of a fully selective gate recess etch 0.12-mu m InP HEMT process fabrica
ted on 2-mm-thick 3-in diameter InP substrates with slot via holes; 2) a de
sign based on a novel on-wafer load-pull measurement technique; and 3) an a
ccurate large-signal nonlinear model for InP HEMTs. In order to reach the l
ow cost required for mass production, the same MMIC design was fabricated o
n an InP metamorphic HEMT (MHEMT) process. The MHEMT version of the MMIC de
monstrated 41.5% PAE, with an associated output power of 183 mW (305 mW/mm)
and 6.9 dB of power at 60 GHz when measured CW on-wafer. These InP HEMT an
d MHEMT results are, to our knowledge, the highest PAE and power bandwidth
ever reported at V-band.