K. Pinardi et al., Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints, IEEE T COMP, 23(3), 2000, pp. 447-451
Citations number
7
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Flip-chip joining using anisotropically conductive adhesive (ACA) has becom
e a very attractive technique for electronics packaging. Many factors can i
nfluence the reliability of the ACA flip-chip joint. Bump height, is one of
these factors. In this work, the strain development during the thermal cyc
ling test of flip-chip joining with different bump heights was studied, The
effect of bump height is significant in the interface between the bumps an
d the pads. Bigger volume area of high strain is found for higher bump in t
he interface between the bumps and the pads. Our calculations show that the
re is practically no effect of the bump height on the strain variation in t
he bumps and in the pads.