Nonuniform temperature and strain fields in a powered package

This paper analyzes the nonuniform temperature and strain fields resulting from power dissipation in an electronic package. A 208 lead plastic quad fl at pack (PQFP) manufactured by Texas Instruments is used to show the temper ature distribution and mechanical deformation resulting from power dissipat ion in the package. The package is tested experimentally and thermally mode led using finite element analysis to obtain the temperature distribution in the active package. The moire interferometry technique is used to acquire displacement contours of an active PQFP and the results are compared to a u niformly heated sample. The results revealed that the thermal loading due t o internal power dissipation produces significantly different strains than a uniformly heated sample.