W. Ryu et al., High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm, IEEE T COMP, 23(3), 2000, pp. 542-545
Citations number
4
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
This paper firstly reports on the high-frequency SPICE model of the ACF fli
p-chip interconnections up to 13 GHz. The extraction process Is based on an
optimization procedure, called a genetic algorithm, which is known as a ro
bust optimization tool. The proposed equivalent circuit model of the ACF in
terconnection can readily be used in SPICE circuit simulations for signal i
ntegrity analysis of high-frequency packages. Two different ACF interconnec
tions were studied using the Au-coated polymer ball and Ni-filled ball. The
extracted models of the two ACFs were found strongly dependent on not only
size and rigidity of the conducting balls, but also on their magnetic perm
eability.